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Therefore, finding a versatile path that combines strength from diverse material platforms is a prior task for the goal of a fully on-chip MWP system.Īside from the photonic integration, another critical issue is the convergence with electronics integration that has been missing from most of the integrated MWP works. Other integrated photonic materials, such as silicon nitride, chalcogenide, and lithium niobate also encounter similar obstacles in high-level integration. Silicon photonics (SiPh) platform is attractive for its scalable and low-cost implementation of diverse building blocks of MWP systems, but the integration of light source requires significant extra efforts. While indium phosphide (InP) platform allows monolithic integration of all photonic elements, it suffers from relatively large passive waveguide loss and elevated amplifier noise. However, despite significant progress, a complete on-chip solution to fully incorporate all the required photonic components and supporting electronic hardware of MWP system is still missing: currently, most of MWP systems have only implemented partial photonic components as chip-integrated format, while the rest of the system are still constituted by bulk devices or equipment, thereby will induce issues related to large footprint, poor robustness and high power-consumption. Milestones have been achieved in a wide range of MWP functionalities, including filters, arbitrary waveform generators, microwave frequency measurement, tunable true-time delay lines, phase shifters, beamformers, and generic programmable processors, exhibiting a various level of system-integration completeness. Recent years, in particular, new opportunity for MWP has emerged with the advances of integrated photonic circuit (PIC), which enables a dramatic reduction in the system size, weight and power-consumption (SWaP). Its large-bandwidth and low-loss features enable the realization of key functionalities in microwave systems that are not offered by current RF technology. With the impending electronic bandwidth bottleneck in our information society for radio-frequency (RF) networks and Internet of Things, the use of photonics to generate, process and measure wideband microwave signals has been explored extensively, which nowadays is well known as microwave photonics (MWP). This demonstration marks a milestone for the integrated MWP, by providing the technology basis for the miniaturization and massive implementations of various MWP systems.
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Furthermore, the chip-scale MWP IFM system is deployed into realistic tasks, where diverse microwave signals with rapid-varying frequencies at X-band (8–12 GHz) are accurately identified in real-time. The unprecedented integration level brings great promotion to the compactness, reliability and performances of the MWP IFM system, including a wide frequency measurement range (2–34 GHz), ultralow estimation errors (10.85 MHz), and a fast response speed (≈0.3 ns). Applying this hybrid integration methodology, a fully chip-based MWP instantaneous frequency measurement (IFM) system is demonstrated. Here, the status quo is broken and a complete on-chip solution for MWP system is provided, by exploiting hybrid integration of indium phosphide, silicon photonics, and complementary metal-oxide–semiconductor electronics platforms. However, despite significant progress made in terms of integration level, a fully on-chip MWP functional system comprising all the necessary photonic and electronic components, is yet to be demonstrated. Recently, new opportunity for MWP has emerged driven by the advances of integrated photonics. Microwave photonics (MWP) is an emerging field that studies the interaction between microwave and lightwave for myriad communication and information applications.